HiDensity Modules

About HiDensity Modules

Our business is miniature electronics. While the ultimate integration level is an integrated circuit, often the right miniaturisation for a product is a high density module or particularly a combination of integrated elements and miniature assembly. In offering both high density modules and full integration options, HMT can provide a complete solution with right split. Our specialities include:

chip-on board (Au on Al wire-bonding), chip on chip
flip-chip with solder balls, conductive and non-conductive epoxy, underfill and glob-top
stud-bumping for flip-chip production of standard ICs in wafer form, including sawing, stocking
multiple substrates down to 50µm thickness, including FR4, Rogers, Flex, ceramic and glass with smallest dimension PCB technologies, including filled microvias etc.
component procurement and supplier management (ISO9001 and ISO13485) for assemblers and components
optical assembly in clean room & assembly of dice thinned (to 50um)
smallest dimension PCB technologies, inc. 40µm track and clearance, down to 5µm Cu thickness and filled microvias with pad of 120µm and hole of 50µm.
electrical module test design (hardware and software) and production test

HiDensity Substrates - PCB, FR4 and Rogers

PCB technology special features are high reliability, high packing density and high mechanical stability. Together with a special heat-pipe technique, the thermal conductivity reach the same level as hybrid. For application with moderate thermal stress, the PCB technology is highly recommended for Chip on Board (COB) technique in automotive, industrial and telecom applications. A specialty of HMT microelectronic Ltd is to combine ASIC (analog, mixed-signal and digital), μController, E2PROM and power components, mounted as COB or Flip-Chip, to form high-density smart power modules.

Heading	Heading	Heading	Heading
Double side	Both side are available for conductor layer, SMD, Flip-Chip or COB components	Conductors	Copper
Via’s	200 μm typical, 25 μm (fine line), micro-vias (filled), staggered, stacked	Conductor resolution	150 μm (typical), 50 μm (fine line)
Printed resistors	Based on polymer paste	Components	Flip-Chip, Chip on Board (COB), SMD down to 01005, Beam-Lead
Resistor tolerance	30% un-trimmed, 2% trimmed	WireBonding	Gold 25, 30 μm, Aluminum 25, 33 μm
Resistor geometry	0.5 x 0.5 mm (trimable), 0.2 x 0.2 mm	Ribbon Bonding	Gold up to 400 μm, Aluminum up to 400 μm
Resistor types	Linear, NTC, PTC	Outline	all forms (laser-cut, milling, cutting punch tooling)
Resistor trimming	active, passive	Connectors	SIL, DIL, Quad SMD and wire
		Test	100%

HiDensity Substrates - Flex

Flex technology special features are high reliability, high packing density and good mechanical stability. Together with Flip-Chip and COB techniques, high-density easily foldable modules can be realized that fit into any cube.

Heading	Heading	Heading	Heading
Double side	Both side are available for conductor layer, SMD, Flip-Chip or COB components	Conductors	Copper
Via’s	200 μm typical, 25 μm (fine line), micro-vias (filled), staggered, stacked	Conductor resolution	150 μm (typical), 50 μm (fine line)
Printed resistors	Based on polymer paste	Components	Flip-Chip, Chip on Board (COB), SMD down to 01005, Beam-Lead
Resistor tolerance	30% un-trimmed, 2% trimmed	WireBonding	Gold 25, 30 μm, Aluminum 25, 33 μm
Resistor geometry	0.5 x 0.5 mm (trimable), 0.2 x 0.2 mm	Ribbon Bonding	Gold up to 400 μm, Aluminum up to 400 μm
Resistor types	Linear, NTC, PTC	Outline	all forms (laser-cut, milling, cutting punch tooling)
Resistor trimming	active, passive	Connectors	SIL, DIL, Quad SMD and wire
		Test	100%

HiDensity Substrates - Ceramic & Glass

Hybrid technology’s (Al 2 O 3 , known as alumina) special features are excellent reliability, high packing density, high stability and high thermal conductivity. Hybrid technology is highly recommended for Chip on Board (COB) technique in automotive, industrial and telecom applications due to a similar thermal expansion coefficient of silicon and alumina.

Parameter	Specification	Parameter	Specification
Multi-Layer	(up to 16 layers per side)	Conductors	Silver-Palladium, Pure Silver, Gold
Double side	Both sides are available for conductor layer, SMD, Flip-Chip or COB components	Conductor	200 μm (typical
Via’s	up to 800 via’s per substrate (4 inch)	Resolution	100 μm (Gold), <100 μm (etched)
Substrate	4 x 4 inch, standard, 6 x 4 inch, 2 x 2 inch	Components	Chip on Board (COB), SMD down to 0402, BeamLead
Printed resistors	0.15Ω to 10MΩ	Wire-Bonding	Gold 25, 30 μm (standard), Aluminum 25, 33 μm
Resistor tolerance	1% standard, 0.1% minimum	Ribbon-Bonding	Gold 25, 30 μm, Aluminum 25, 33 μm
Resistor geometry	0.5 x 0.5 mm (trimable), 0.2 x 0.2 mm	Outline	all forms (laser-cut, punch tooling)
Resistor types	Linear, Power, NTC, PTC	Connectors	all forms (laser-cut, milling, cutting punch tooling)
Resistor trimming	active, passive	Connectors	SIL, DIL, Quad SMD and wire
Resistor temperature coefficient TK	50ppm (typical)	Test	100%
Resistor trimming	active, passive

Chip on Module Assembly

Bare dice and chip-scale packages can be mounted with the following techniques:

chip on board (COB) with conductive or non-conductive die attach, wirebonding (Au/Al, wire or ribbon to flash gold on PCB) and glob-top
chip-on-chip with wire-bonding from each chip to the board and between chips
flip-chip with solder balls (min. pitch ca. 250µm), solder on copper pillar (min. pitch ca. 150µm), stud-bump with conductive or non-conductive adhesive, under-fill and glob-top

HMT can handle the use of purchased standard ICs in wafer form including thinning, sawing and stocking. Wafers can additionally be in-house stud-bumped where a post-processing solder ball deposition is not possible or not appropriate for the volumes.

Depending on the application (eg. inside a contact lens!) achieving a minimum chip thickness is essential. HMT can handle the assembly of dice thinned (to 50µm).

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